Introduction of the Polyimide

Polyimide is a kind of polymer containing the imide ring (-co - nh-co -) on the main chain, which is the most important for the polymer containing phthalimide structure. As a special engineering material, polyimide has been widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation film, laser and so on.

Polyimide is one of the best comprehensive properties of organic polymer materials, high temperature of 400 ℃ above, use for a long time - 200 ~ 300 ℃ temperature range, no obvious melting point, high insulation performance, 103 hz dielectric constant under 4.0, the dielectric loss is only 0.004 ~ 0.007, F and H.

Feature of 2,2-Bis[4-(4-aminophenoxy)phenyl ]-hexafluoropropanane (HFBAPP)  CAS NO.69563-88-8

1. Excellent thermal stability

2. Good chemical resistance

3. Stable mechanical properties

4. Polyimide does not require the addition of flame retardants to prevent combustion.

The related chemicals of 2,2-Bis[4-(4-aminophenoxy)phenyl ]-hexafluoropropanane (HFBAPP)  CAS NO.69563-88-8

1. 9,9-Bis(4-aminophenyl)fluorene (FDA) CAS NO.15499-84-0

2. 2,3,3',4'-BiphenyLtetracarboxylic (α-BPDA)  CAS NO.36978-41-3

3. 2,2'-Bis(4-aminophenoxyphenyl) propane (BAPP)  CAS NO.13080-86-9

4. 3,3'-Dimethyl-[1,1'-biphenyl]-4,4'- Diamine (O-Tolidine)  CAS NO. 119-93-7

       5. 1,1-Bis(4-aminophenyl) cyclohexane  CAS NO.3282-99-3