GP5000S35-0.040-02-0816 BERGQUIST GP5000S35 Features and Benefits
? High-thermal conductivity: 5.0 W/m-K
? Highly conformable, “S-Class” softness
? Naturally-inherent tack reduces
interfacial thermal resistance
? Conforms to demanding contours and
maintains structural integrity with little
or no stress applied to fragile
component leads
? Fiberglass reinforced for puncture,
shear and tear resistance
? Excellent thermal performance at
low pressures
GP5000S35-0.040-02-0816 BERGQUIST GAP PAD TGP 5000(thermal pad) is a fiberglass-reinforced filler and polymer featuring
a high thermal conductivity. The material yields extremely soft characteristics while maintaining
elasticity and conformability. The fiberglass reinforcement provides easy handling and converting,
added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application
and allows the product to effectively fill air gaps,enhancing the overall thermal performance.The top side has
reduced tack for ease of handling. GP5000S35-0.040-02-0816 BERGQUIST GP5000S35 is ideal for high-performance
applications at low mounting pressures.
GP5000S35-0.040-02-0816 BERGQUIST GAP PAD 5000S35(BERGQUIST thermal pad) Typical Applications Include:
? Voltage Regulator Modules (VRMs) and POLs
? CD-ROMs and DVD-ROMs
? PC Board to chassis
? ASICs and DSPs
? Memory packages and modules
? Thermally-enhanced BGAs
Configurations Available:
? Die-cut parts are available in any shape or size, separated or in sheet form
關(guān)鍵字： BERGQUIST GP5000S35;GAP PAD TGP 5000;GAP PAD 5000S35;
Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
Company culture, Integrity and pragmatism, quick response, keep improving.